Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538842 | Chip scale package structures | Yu-Min Lin | 2022-12-27 |
| 11387159 | Chip package | Kuo-Shu Kao, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin +1 more | 2022-07-12 |
| 11355472 | Package structure and method for connecting components | Yu-Min Lin, Wei-Chung Lo | 2022-06-07 |
| 11239168 | Chip package structure | Hsin-Han Lin, Yu-Min Lin | 2022-02-01 |
| 11239211 | Electronic device having a curved portion between a plurality of conductive portions on a substrate | Wei Han, Jing-Yao Chang | 2022-02-01 |