Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11315876 | Thin film conductive material with conductive etch stop layer | Yun Ling Tan, Yudi Setiawan, Siow Lee Chwa | 2022-04-26 |
| 11244915 | Bond pads of semiconductor devices | Ramasamy Chockalingam, Juan Boon Tan, Chee Kong Leong, Ranjan Rajoo, Xiaodong Li | 2022-02-08 |