Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444045 | Bonding structures of semiconductor devices | Ramasamy Chockalingam, Juan Boon Tan, Xiaodong Li, Kai Chong Chan | 2022-09-13 |
| 11244915 | Bond pads of semiconductor devices | Ramasamy Chockalingam, Juan Boon Tan, Chee Kong Leong, Xuesong Rao, Xiaodong Li | 2022-02-08 |