Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444045 | Bonding structures of semiconductor devices | Juan Boon Tan, Xiaodong Li, Kai Chong Chan, Ranjan Rajoo | 2022-09-13 |
| 11244915 | Bond pads of semiconductor devices | Juan Boon Tan, Chee Kong Leong, Ranjan Rajoo, Xuesong Rao, Xiaodong Li | 2022-02-08 |
| 11217496 | Test pad with crack stop protection | Juan Boon Tan, Wanbing Yi | 2022-01-04 |