Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322465 | Metal layer patterning for minimizing mechanical stress in integrated circuit packages | Kathryn R. Holland, Marc Tarabbia, Yaoyu Pang | 2022-05-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322465 | Metal layer patterning for minimizing mechanical stress in integrated circuit packages | Kathryn R. Holland, Marc Tarabbia, Yaoyu Pang | 2022-05-03 |