Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322465 | Metal layer patterning for minimizing mechanical stress in integrated circuit packages | Marc Tarabbia, Yaoyu Pang, Alexander L. Barr | 2022-05-03 |
| 11300987 | Managing on-chip power rail between internal power supply and external power supply | Wesley L. Mokry, Neel PRAMANIK, Christian Larsen | 2022-04-12 |