Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373968 | Via structure for semiconductor dies | Steven A. Atherton | 2022-06-28 |
| 11322465 | Metal layer patterning for minimizing mechanical stress in integrated circuit packages | Kathryn R. Holland, Marc Tarabbia, Alexander L. Barr | 2022-05-03 |