Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11328987 | Waver-level packaging based module and method for producing the same | Ivan Ndip, Klaus-Dieter Lang | 2022-05-10 |
TB
Tanja Braun
Overall (2022): #242,526 of 548,613Top 45%
1
Patents 2022