Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11394109 | Module arrangement comprising embedded components and an integrated antenna, device comprising module arrangements, and method for manufacturing | Andreas Ostmann | 2022-07-19 |
| 11328987 | Waver-level packaging based module and method for producing the same | Tanja Braun, Klaus-Dieter Lang | 2022-05-10 |
| 11330699 | Non-overlapping power/ground planes for localized power distribution network design | Arif Ege Engin, Gerardo Aguirre, Klaus-Dieter Lang | 2022-05-10 |
| 11283166 | Module unit having integrated antennas | Kai Zoschke, Klaus-Dieter Lang | 2022-03-22 |
| 11271297 | Three-dimensional antenna device | Christine Kallmayer, Klaus-Dieter Lang | 2022-03-08 |