Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11328987 | Waver-level packaging based module and method for producing the same | Ivan Ndip, Tanja Braun | 2022-05-10 |
| 11330699 | Non-overlapping power/ground planes for localized power distribution network design | Arif Ege Engin, Gerardo Aguirre, Ivan Ndip | 2022-05-10 |
| 11283166 | Module unit having integrated antennas | Ivan Ndip, Kai Zoschke | 2022-03-22 |
| 11271297 | Three-dimensional antenna device | Ivan Ndip, Christine Kallmayer | 2022-03-08 |