Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11442364 | Materials and methods for forming resist bottom layer | Jing Hong Huang, Chien-Wei Wang, Ching-Yu Chang | 2022-09-13 |
| 11320738 | Pattern formation method and material for manufacturing semiconductor devices | Chien-Wei Wang, Ching-Yu Chang, Yen-Hao Chen | 2022-05-03 |