Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11533819 | Method for manufacturing a stack structure | Le Liang | 2022-12-20 |
| 11532538 | Component structure, power module and power module assembly structure | Shouyu Hong, Juan CHENG, Tao Wang | 2022-12-20 |
| 11490516 | Power module structure | Shouyu Hong, Haibin Xu, Wei Cheng, Juan CHENG, Tao Wang | 2022-11-01 |
| 11342241 | Power module | Wei Cheng, Shouyu Hong, Dongfang Lian, Tao Wang | 2022-05-24 |
| 11342257 | Carrier board and power module using same | Shouyu Hong, Haibin Xu, Tao Wang, Yan Tong, Weicheng Zhou +2 more | 2022-05-24 |
| 11320879 | Power supply module and electronic device | Pengkai Ji, Shouyu Hong, Xiaoni Xin | 2022-05-03 |
| 11316438 | Power supply module and manufacture method for same | Pengkai Ji, Shouyu Hong, Xiaoni Xin, Le Liang | 2022-04-26 |
| 11245214 | Connector, method for manufacturing connector and signal pin assembly | Shouyu Hong, Qingdong Chen, Ganyu Zhou, Pengkai Ji, Yiqing Ye | 2022-02-08 |
| 11227856 | Multi-chip package power module | Pengkai Ji, Xiaoni Xin, Yan Chen, Qingdong Chen, Shouyu Hong +1 more | 2022-01-18 |