Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11399438 | Power module, chip-embedded package module and manufacturing method of chip-embedded package module | Shouyu Hong, Qingdong Chen, Ganyu Zhou, Xiaoni Xin, Pengkai Ji | 2022-07-26 |
| 11227856 | Multi-chip package power module | Pengkai Ji, Xiaoni Xin, Qingdong Chen, Shouyu Hong, Jianhong Zeng +1 more | 2022-01-18 |