Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11435797 | Manufacturing method of power module | Shouyu Hong, Yiqing Ye, Kai Lu, Le Liang, Jianhong Zeng | 2022-09-06 |
| 11399438 | Power module, chip-embedded package module and manufacturing method of chip-embedded package module | Shouyu Hong, Ganyu Zhou, Yan Chen, Xiaoni Xin, Pengkai Ji | 2022-07-26 |
| 11342257 | Carrier board and power module using same | Shouyu Hong, Haibin Xu, Tao Wang, Yan Tong, Weicheng Zhou +2 more | 2022-05-24 |
| 11277912 | System of providing power | Shouyu Hong, Zhiheng Fu, Haoyi Ye, Yiqing Ye, Jinping Zhou +3 more | 2022-03-15 |
| 11277067 | Power module and manufacturing method thereof | Shouyu Hong, Kai Lu, Pengkai Ji, Xiaoni Xin, Min Zhou +2 more | 2022-03-15 |
| 11245214 | Connector, method for manufacturing connector and signal pin assembly | Shouyu Hong, Ganyu Zhou, Pengkai Ji, Yiqing Ye, Zhenqing Zhao | 2022-02-08 |
| 11227856 | Multi-chip package power module | Pengkai Ji, Xiaoni Xin, Yan Chen, Shouyu Hong, Jianhong Zeng +1 more | 2022-01-18 |