Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11467458 | Circuit substrate | Kuo-Yu Huang | 2022-10-11 |
| 11362216 | Active device substrate and manufacturing method thereof | — | 2022-06-14 |
| 11355391 | Method for forming a metal gapfill | Xi Cen, Feiyue Ma, Kai Wu, Yu Lei, Kazuya Daito +13 more | 2022-06-07 |