Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11470714 | Component carrier with embedded component and horizontally elongated via | Gin Feng, Sally Sun, Seok Kim Tay | 2022-10-11 |
| 11452212 | Component carrier with electrically conductive layer structures having windows defined by a conformal mask and tapering at least partially | Seok Kim Tay, Sally Sun | 2022-09-20 |
| 11445601 | Component carrier and method of manufacturing a component carrier | Seok Kim Tay | 2022-09-13 |
| 11410965 | Electronic device with embedded component carrier | — | 2022-08-09 |
| 11343916 | Component carrier and method of manufacturing the same | — | 2022-05-24 |
| 11330706 | Component carrier with embedded large die | Seok Kim Tay | 2022-05-10 |
| 11291119 | Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus | Nick Xin, Seok Kim Tay | 2022-03-29 |
| 11284508 | Semi-flex component carrier with dielectric material having high elongation and low young modulus | Nick Xin, Seok Kim Tay | 2022-03-22 |
| 11219120 | Stress relief opening for reducing warpage of component carriers | Artan Baftiri, Nick Xin | 2022-01-04 |
| 11219129 | Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design rule | — | 2022-01-04 |