Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11291119 | Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus | Mikael Tuominen, Seok Kim Tay | 2022-03-29 |
| 11284508 | Semi-flex component carrier with dielectric material having high elongation and low young modulus | Mikael Tuominen, Seok Kim Tay | 2022-03-22 |
| 11219120 | Stress relief opening for reducing warpage of component carriers | Mikael Tuominen, Artan Baftiri | 2022-01-04 |