Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11470714 | Component carrier with embedded component and horizontally elongated via | Gin Feng, Seok Kim Tay, Mikael Tuominen | 2022-10-11 |
| 11452212 | Component carrier with electrically conductive layer structures having windows defined by a conformal mask and tapering at least partially | Mikael Tuominen, Seok Kim Tay | 2022-09-20 |