Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11510320 | Method of processing wiring substrate | Muneyuki Sato, Yasuhiro Morikawa | 2022-11-22 |
| 11495466 | Processing method of wafer | Hideyuki Sandoh | 2022-11-08 |
| D962096 | Sample analyzer | Sayaka Obana, Toru Takegawa, Hiroya Nagasawa, Ikuo Wakayama | 2022-08-30 |
| 11302559 | Electrostatic chuck | Yutaka MOMIYAMA, Hitoshi Sasaki, Tsukasa Shigezumi | 2022-04-12 |
| 11302560 | Electrostatic chuck | Yutaka MOMIYAMA, Hitoshi Sasaki, Tsukasa Shigezumi | 2022-04-12 |