Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532497 | High power electrostatic chuck design with radio frequency coupling | Jaeyong Cho, Haitao Wang, Kartik Ramaswamy, Chunlei Zhang | 2022-12-20 |
| 11527429 | Substrate support assembly for high temperature processes | — | 2022-12-13 |
| 11482444 | High temperature micro-zone electrostatic chuck | — | 2022-10-25 |
| 11476146 | Substrate support assembly with deposited surface features | Wendell Glenn Boyd, Jr., Teng-Fang Kuo, Zhenwen Ding | 2022-10-18 |
| 11450546 | Semiconductor substrate support with internal channels | — | 2022-09-20 |
| 11410869 | Electrostatic chuck with differentiated ceramics | — | 2022-08-09 |
| 11265971 | Sensor system for multi-zone electrostatic chuck | — | 2022-03-01 |