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Home › 2022 › Apple › Hung-Wei Hsu
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Hung-Wei Hsu — 2 Patents in 2022

CDCo-Tech Development: 2 patents #1 of 4Top 25%
Taipei, TW: #364 of 2,592 inventorsTop 15%
Overall (2022): #153,379 of 548,613Top 30%
2 Patents 2022

Issued Patents 2022

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11408087 Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the same Yun-Hsing Sung, Shih-Shen Lee, Chun-Yu Kao 2022-08-09
11332839 Advanced electrodeposited copper foil and copper clad laminate using the same Yun-Hsing Sung, Shih-Shen Lee, Chun-Yu Kao 2022-05-17

Nearby-Ranked Inventors

Hui Peng Hu2
Huibing Hu2
Hung-Tzaw Hu2
Huanhui Hu2
Hung-Ming Hsu2
Hunghuei Hsu2
Hung-Chang Hsiao2
Hussein Hoteit2
Huan-Ciao Hong2