Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11408087 | Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the same | Shih-Shen Lee, Hung-Wei Hsu, Chun-Yu Kao | 2022-08-09 |
| 11332839 | Advanced electrodeposited copper foil and copper clad laminate using the same | Shih-Shen Lee, Hung-Wei Hsu, Chun-Yu Kao | 2022-05-17 |