Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476232 | Three-dimensional packaging techniques for power FET density improvement | Albert M. Wu, Zafer Kutlu | 2022-10-18 |
| 11410977 | Electronic module for high power applications | Frederick E. Beville, Yucheng Ying, Zafer Kutlu | 2022-08-09 |
| 11270986 | Package with overhang inductor | Ahmadreza Odabaee, Zafer Kutlu, Zhengyang Liu, George Anthony Serpa | 2022-03-08 |
| 11272618 | Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits | Frederick E. Beville, David Alan Pruitt | 2022-03-08 |