Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296019 | Vertically structured pad system | Kwang Hong Tan, Mihalis Michael | 2022-04-05 |
| 11272618 | Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits | John David Brazzle, Frederick E. Beville | 2022-03-08 |