Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476232 | Three-dimensional packaging techniques for power FET density improvement | Albert M. Wu, John David Brazzle | 2022-10-18 |
| 11410977 | Electronic module for high power applications | John David Brazzle, Frederick E. Beville, Yucheng Ying | 2022-08-09 |
| 11270986 | Package with overhang inductor | Ahmadreza Odabaee, John David Brazzle, Zhengyang Liu, George Anthony Serpa | 2022-03-08 |