Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469134 | Plating chuck | Hui Wang, Jian Wang, Hongchao Yang | 2022-10-11 |
| 11257667 | Methods and apparatus for cleaning semiconductor wafers | Jun Wang, Hui Wang, Fufa Chen, Fuping Chen, Jian Wang +5 more | 2022-02-22 |