Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482664 | Planarization method | Kahkeen Lai, Yilei Wu | 2022-10-25 |
| 11305988 | Method for preparing silicon wafer with rough surface and silicon wafer | Wooicheang Goh, Kahkeen Lai | 2022-04-19 |