Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205619 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu +1 more | 2021-12-21 |
| 11049834 | Hybrid bonding using dummy bonding contacts | Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu +1 more | 2021-06-29 |