Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164840 | Chip interconnection structure, wafer interconnection structure and method for manufacturing the same | Guoliang YE, Jiaqi Wang | 2021-11-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164840 | Chip interconnection structure, wafer interconnection structure and method for manufacturing the same | Guoliang YE, Jiaqi Wang | 2021-11-02 |