Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164840 | Chip interconnection structure, wafer interconnection structure and method for manufacturing the same | Hongsheng YI, Guoliang YE | 2021-11-02 |
| 11143025 | Mine exploitation based on stoping, separation and filling control | Jixiong Zhang, Qiang Zhang, Zhongyu WU, Feng Ju, Yang Chen | 2021-10-12 |
| 11082768 | Apparatus with acoustic enhancement and method for the same | Kok Huan Ong, Wei-Peng Renny LIM | 2021-08-03 |
| 11049217 | Magnifying feature map | Kai Chen, Rui Xu, Ziwei Liu, Chen Change Loy, Dahua Lin | 2021-06-29 |