Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164834 | Wafer structure and method for manufacturing the same, and chip structure | Di ZHAN, Tianjian Liu | 2021-11-02 |
| 11164840 | Chip interconnection structure, wafer interconnection structure and method for manufacturing the same | Hongsheng YI, Jiaqi Wang | 2021-11-02 |
| D929737 | Storage container | — | 2021-09-07 |
| 10930619 | Multi-wafer bonding structure and bonding method | — | 2021-02-23 |