Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11164813 | Transistor semiconductor die with increased active area | Daniel Jenner Lichtenwalner | 2021-11-02 | $110,616,000 |
| 11075264 | Super junction power semiconductor devices formed via ion implantation channeling techniques and related methods | Alexander V. Suvorov, Vipindas Pala, Daniel Jenner Lichtenwalner, Qingchun Zhang | 2021-07-27 | $42,601,000 |
| 11057033 | Hybrid power module | Adam Barkley, Sei-Hyung Ryu, Zachary Cole, Kraig J. Olejniczak | 2021-07-06 | $133,004,000 |
| 10998418 | Power semiconductor devices having reflowed inter-metal dielectric layers | Daniel Jenner Lichtenwalner, Shadi Sabri | 2021-05-04 | $139,284,000 |
| 10950719 | Seminconductor device with spreading layer | Vipindas Pala, Lin Cheng, Anant Agarwal, John Williams Palmour | 2021-03-16 | $80,803,000 |