Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10985132 | Bonding apparatus, bonding system, bonding method and storage medium | Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa | 2021-04-20 |
| 10946419 | Foreign substance removal apparatus and foreign substance detection apparatus | Osamu Hirakawa | 2021-03-16 |
| 10882234 | Mold | Hiroshi Yonekubo | 2021-01-05 |