Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094667 | Bonding apparatus, bonding system, bonding method, and recording medium | Shuhei Matsumoto, Toshifumi Inamasu | 2021-08-17 |
| 10985132 | Bonding apparatus, bonding system, bonding method and storage medium | Yoshitaka Otsuka, Yosuke Omori, Kenji Sugakawa | 2021-04-20 |