Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094667 | Bonding apparatus, bonding system, bonding method, and recording medium | Takashi Nakamitsu, Toshifumi Inamasu | 2021-08-17 |
| 11008208 | Spout for a refill container | Frank Zeiter | 2021-05-18 |