Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11113443 | Integrated circuit with thicker metal lines on lower metallization layer | Kuang-Hung Chang, Yuan-Te Hou, Chung-Hsing Wang | 2021-09-07 |
| 11017149 | Machine-learning design enablement platform | Yi-Lin Chuang, Ching-Fang Chen, Wei-Li Chen, Wei-Pin Changchien, Yun-Han Lee | 2021-05-25 |