Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11113443 | Integrated circuit with thicker metal lines on lower metallization layer | Yuan-Te Hou, Chung-Hsing Wang, Yung-Chin Hou | 2021-09-07 |
KC
Kuang-Hung Chang
Overall (2021): #368,585 of 548,734Top 70%
1
Patents 2021