Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011419 | Method for forming interconnect structure | Bor-Zen Tien, Jhu-Ming Song, Hsuan-Han Lin, Kuang-Hsin Chen, Tzong-Sheng Chang | 2021-05-18 |
ML
Mu-Yi Lin
Overall (2021): #323,547 of 548,734Top 60%
1
Patents 2021