Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011419 | Method for forming interconnect structure | Bor-Zen Tien, Jhu-Ming Song, Kuang-Hsin Chen, Mu-Yi Lin, Tzong-Sheng Chang | 2021-05-18 |
HL
Hsuan-Han Lin
Overall (2021): #429,553 of 548,734Top 80%
1
Patents 2021