Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011419 | Method for forming interconnect structure | Bor-Zen Tien, Hsuan-Han Lin, Kuang-Hsin Chen, Mu-Yi Lin, Tzong-Sheng Chang | 2021-05-18 |
JS
Jhu-Ming Song
Overall (2021): #407,139 of 548,734Top 75%
1
Patents 2021