Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211318 | Bump layout for coplanarity improvement | Ling Li, Cheng-Lin Huang, Min-Tar Liu, Fu-Kang Chiao, Matt Chou +3 more | 2021-12-28 |
| 11088108 | Chip package structure including ring-like structure and method for forming the same | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li +2 more | 2021-08-10 |
| 11069652 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2021-07-20 |
| 11004728 | Semiconductor die having edge with multiple gradients and method for forming the same | Yu-Sheng Tang, Fu-Chen Chang, Cheng-Lin Huang, Wen-Ming Chen, Chun-Yen Lo | 2021-05-11 |