Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211318 | Bump layout for coplanarity improvement | Ling Li, Min-Tar Liu, Fu-Kang Chiao, Matt Chou, Chun-Yen Lo +3 more | 2021-12-28 |
| 11088108 | Chip package structure including ring-like structure and method for forming the same | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Chien-Chen Li, Lieh-Chuan Chen +2 more | 2021-08-10 |
| 11004728 | Semiconductor die having edge with multiple gradients and method for forming the same | Yu-Sheng Tang, Fu-Chen Chang, Wen-Ming Chen, Chun-Yen Lo, Kuo-Chio Liu | 2021-05-11 |