Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211318 | Bump layout for coplanarity improvement | Ling Li, Cheng-Lin Huang, Min-Tar Liu, Fu-Kang Chiao, Matt Chou +3 more | 2021-12-28 |
| 11004728 | Semiconductor die having edge with multiple gradients and method for forming the same | Yu-Sheng Tang, Fu-Chen Chang, Cheng-Lin Huang, Wen-Ming Chen, Kuo-Chio Liu | 2021-05-11 |