Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189659 | Techniques for MRAM MTJ top electrode to via interface | Harry-Hak-Lay Chuang, Hung Cho Wang, Sheng-Huang Huang | 2021-11-30 |
| 11075335 | Techniques for MRAM MTJ top electrode connection | Harry-Hak-Lay Chuang, Chen-Pin Hsu, Hung Cho Wang, Wen-Chun You, Sheng-Chang Chen +2 more | 2021-07-27 |
| 11043531 | Semiconductor structure and manufacturing method of the same | Alexander Kalnitsky, Sheng-Huang Huang, Harry-Hak-Lay Chuang, Hung Cho Wang | 2021-06-22 |
| 11005032 | Techniques for MRAM MTJ top electrode to metal layer interface including spacer | Harry-Hak-Lay Chuang, Hung Cho Wang, Sheng-Huang Huang | 2021-05-11 |