Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164956 | Capping layer for gate electrodes | Chin-Hsiang Lin, Teng-Chun Tsai, Huang-Lin Chao | 2021-11-02 |
| 11056393 | Method for FinFET fabrication and structure thereof | Han-Yu Lin, Yi-Ruei Jhan, Fang-Wei Lee, Tze-Chung Lin, Chao-Hsien Huang +2 more | 2021-07-06 |
| 11018053 | Semiconductor structure with material modification and low resistance plug | Mrunal A. Khaderbad | 2021-05-25 |