HL

Hun Teak Lee

SC Stats Chippac: 2 patents #9 of 28Top 35%
Overall (2021): #155,355 of 548,734Top 30%
2
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11145603 Integrated circuit packaging system with shielding and method of manufacture thereof Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more 2021-10-12
11024585 Integrated circuit packaging system with shielding and method of manufacture thereof Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more 2021-06-01