Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950520 | Electronic package, method for fabricating the same, and heat dissipator | Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Kuo-Hua Yu, Wen-Shan Tsai +2 more | 2021-03-16 |
| 10903088 | Electronic package and method for fabricating the same | Shu-Chi Chang, Wei Wang, Hsien-Lung Hsiao | 2021-01-26 |