Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101566 | Method for fabricating electronic package | Han-Hung Chen, Chun-Yi Huang, Chang-Fu Lin, Rung-Jeng Lin | 2021-08-24 |
| 10950520 | Electronic package, method for fabricating the same, and heat dissipator | Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Wen-Shan Tsai, En-Li Lin +2 more | 2021-03-16 |