Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069661 | Electronic package | Wei-Jhen Chen, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu | 2021-07-20 |
| 10950520 | Electronic package, method for fabricating the same, and heat dissipator | Chee-Key Chung, Chang-Fu Lin, Kuo-Hua Yu, Wen-Shan Tsai, En-Li Lin +2 more | 2021-03-16 |