Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211408 | Wiring layer and manufacturing method therefor | Tomoaki Moriwaka, Shinya Sasagawa, Takashi Ohtsuki | 2021-12-28 |
| 10971491 | Method for forming capacitor, semiconductor device, module, and electronic device | Tetsuhiro Tanaka | 2021-04-06 |
| 10944014 | Semiconductor device | Shunpei Yamazaki, Akihisa Shimomura, Yuhei Sato, Yasumasa YAMANE, Yoshitaka Yamamoto +4 more | 2021-03-09 |